New Equipment | Solder Materials
FCT Assembly has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to th
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Fri Sep 17 03:03:29 EDT 2010 | grahamcooper22
Hi Gani, looking at the HASL icture and the poor wetting of the solder over the pads I would imagine that the HASL coating is very thin on the pads and in actual fact isn't 'solder' but is tin /copper intemetallic and this has poor solderability. It
Electronics Forum | Mon Apr 23 19:12:23 EDT 2001 | relensky
Thanks for the instructions. I was missing the reflow part... Omikron is the method our board house offers. We have been through the plating thickness problem and tin depletion conditions. Beyond those issues, I have been trying a few different n
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Technical Library | 2016-05-26 15:07:36.0
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting. In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb
SMTnet Express, May 26, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Influence of Salt Residues on BGA Head on Pillow (Hip) J. Servin, P. Gomez, M. Dominguez, A. Aragon; Continental Corporation The oxide layers are known as wetting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Activator cleans metal surfaces of oxides and contaminants, promoting wetting of Solder Alloy. Activator is consumed by heat over time
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=0
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
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