Electronics Forum | Thu Aug 29 07:21:28 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Fri Feb 28 01:36:43 EST 2020 | crystal12
> What is the use of gold plated boards? <BR> <BR> With the increasing integration of IC, the more IC the more dense. The vertical tin spray process is difficult to flatten the pads, which brings difficulty to the SMT mounting, and
Electronics Forum | Wed May 15 10:55:35 EDT 2002 | geoff_goring
As I thought..... This is probably why most journals and standards I have studied hold shy of even attempting to predict shelf life. They certainly hold off of any predictions when based on accelerated life testing too. The component lead is a cop
Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef
It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu
Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster
At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Mon Nov 19 20:15:39 EST 2001 | davef
Now, that is one thickass board!!! The rant first: If our �board supplier changed our board surface finish on� anything without our approval, the board supplier would be an �X�. Life has enough surprises. And of all the flat finishes available, h
Electronics Forum | Thu Sep 02 10:24:35 EDT 2004 | dj_jago
Greetings from the UK: I have been quite fortunate to lead (no pun intended) our company towards lead free sooner rater than later. One of our customers produces a product which is refurbushed every 6 months or so and sent back into the market. A
Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
