Industry News | 2022-10-06 18:05:48.0
IPC announces the first employee of its new legal entity in Germany, Hans-Peter Tranitz, Ph.D. Dr. Tranitz will serve as senior director, Solutions, at IPC Electronics Europe GmbH in Munich. In this role, Dr. Tranitz will focus on IPC global initiatives including automotive electronics, advanced packaging, and Factory of the Future as well as serving as a technical resource for regional activities in Europe.
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
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Large Format PCB's ACI has made substantial investments in the production of Large Format PCB's. This unique capability allows us to build plated-thru structures up to 24" wide by 102" in length utilizing almost any material type. We produce a vari
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Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
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