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Best Technical Papers at IPC APEX EXPO 2022 Selected

Industry News | 2022-01-14 17:06:40.0

Expanded technical conference award categories include NextGen and Student Research

Association Connecting Electronics Industries (IPC)

Wraparound Thick Film Chip Resistors

Wraparound Thick Film Chip Resistors

New Equipment | Components

RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen

International Manufacturing Services (IMS)

Large Format PCB's Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

Large Format PCB's Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

New Equipment | Fabrication Services

Large Format PCB's ACI has made substantial investments in the production of Large Format PCB's.  This unique capability allows us to build plated-thru structures up to 24" wide by 102" in length utilizing almost any material type. We produce a vari

Advanced Circuitry International

Multilayer PCB Fabrication

Multilayer PCB Fabrication

New Equipment | Fabrication Services

Multilayer PCB's ACI manufactures a wide variety of Multilayer PCB's for various applications spanning numerous industries and technologies.  We can build your high layer count PCB's using a wide variety of high speed low loss materials from epoxies

Advanced Circuitry International

Effects of Tin Whisker Formation on Nanocrystalline Copper

Technical Library | 2023-02-13 19:23:18.0

Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.

Johns Hopkins Applied Physics Laboratory

Aluminum PCB

Aluminum PCB

New Equipment | Assembly Services

TW-Aluminum PCB 0201 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y

TW Technology Limited

FPC--Flexible PCB

FPC--Flexible PCB

New Equipment | Assembly Services

TW-FPC--Flexible PCB 0187 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units p

TW Technology Limited

Flex-Rigid PCB

Flex-Rigid PCB

New Equipment | Assembly Services

TW-Flex-Rigid PCB 0156 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per

TW Technology Limited

HDI PCB

HDI PCB

New Equipment | Assembly Services

TW-HDI PCB 0245 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Year o

TW Technology Limited


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