Industry Directory: max (24)

Max Top Company

Industry Directory |

Solder Wire, Solder Bar, Solder Paste, Solder Ball

SeMax Wireless, Inc

Industry Directory |

SeMax Wireless, Inc. designs & manufactures leading edge, 800/1900MHz, CDMA wireless communication devices. Visit our site, www.semaxwireless.com and see some of our existing OEM products and capabilities. Applications include: AVL, Security System Monitoring, Automatic Meter Reading & Remote Equipment Sensing.

New SMT Equipment: max (740)

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: max (743)

Recommended max board temp for BGA repair

Electronics Forum | Wed Aug 10 16:04:09 EDT 2005 | rrylande

I am concerned about delamination and other modes of damaging the board itself. Am I mistaken to believe that raising the entire board to near reflow temperatures (during the repair of a single BGA) may damage the quality of the board?

Recommended max board temp for BGA repair

Electronics Forum | Wed Aug 10 17:02:32 EDT 2005 | Inds

wats the thickness of your board.. and the dimension.. I would not heat the board beyond 150deg C.. coz if the board is thick and large.. it will take a long time to reach that temp..and you will burn off your flux.causing poor solder joint. Ind

Used SMT Equipment: max (1296)

Heller 1936 Air – Mark 5 Reflow Oven

Heller 1936 Air – Mark 5 Reflow Oven

Used SMT Equipment | Soldering - Reflow

10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control

Heller Industries Inc.

Heller 1913 Nitrogen – Mark 3 Reflow Oven

Heller 1913 Nitrogen – Mark 3 Reflow Oven

Used SMT Equipment | Soldering - Reflow

13 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane, Gen 5.2, OMS

Heller Industries Inc.

Industry News: max (173)

GPD Global's MAX Series Provides Maximum Accuracy

Industry News | 2011-04-22 21:36:56.0

GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.

GPD Global

GPD Global Places MAX II Precision Dispenser at Universal Instruments' Advanced Process Lab

Industry News | 2019-12-17 14:33:13.0

December 17, 2019 – GPD Global has placed a MAX II precision dispenser at Universal's lab in New York (APL).

GPD Global

Parts & Supplies: max (113)

Yamaha YG200 YAMAHA  medium speedchip mounter

Yamaha YG200 YAMAHA medium speedchip mounter

Parts & Supplies | Semiconductor & Solar

Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop: 24400 CPH (0.147 SEC/SOPconversion) (Max 80 varieties

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YG200 YAMAHA

Yamaha YG200 YAMAHA

Parts & Supplies | Chipshooters / Chip Mounters

Product name: YG200 YAMAHA  medium speedchip mounter Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop:

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: max (3)

Revolutionize PCB Manufacturing with SMT Dispensing Machines

Technical Library | 2023-12-18 11:33:57.0

Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. ​In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues

I.C.T ( Dongguan ICT Technology Co., Ltd. )

On Oreology, the fracture and flow of "milk's favorite cookie® "

Technical Library | 2024-08-29 18:30:46.0

The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study

1st Place Machinery Inc.

Videos: max (995)

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Career Center - Jobs: max (4)

Assembler

Career Center | , | 2018-02-22 12:50:43.0

Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow

Assembler

Career Center | , | 2018-02-22 12:51:59.0

Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow

Career Center - Resumes: max (7)

smt technicina

Career Center | chennai, India | Engineering,Maintenance

Nokia India Pvt LTD.       Sriperumpudur – Board Assembler Maintenance Technician  from Sep 2009 to till now. Machines Handled  Pick & Place     : FUJI NXT Machines  FUJI NXT - M3 II ,M3S.  Reflow oven: Hot flow 3/20, 2/14.  Stencil Pr

QUALITY CONTROL MANAGER

Career Center | BANGALORE, Karnataka India | Quality Control

New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud

Express Newsletter: max (174)

Partner Websites: max (2853)

Nominal Epad vs Max Epad - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/nominal-epad-vs-max-epad_topic2530.html

Nominal Epad vs Max Epad - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login Nominal Epad vs Max Epad

PCB Libraries, Inc.

Alumilum MXH6-50Z SMC Air Cylinder Original Max 0.7MPa

KingFei SMT Tech | https://www.smtspare-parts.com/sale-14323908-alumilum-mxh6-50z-smc-air-cylinder-original-max-0-7mpa.html

Alumilum MXH6-50Z SMC Air Cylinder Original Max 0.7MPa Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech


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