New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Electronics Forum | Fri May 26 10:17:21 EDT 2006 | pjc
Here are settings for a Vitronics SMR500 oven for Indium Corp. 5.1 No-Clean Pb Free solderpaste, the product profiled was of medium thermal mass: RTS, Temp C 120, 170, 195, 248, 264, conveyor speed was 43cm/min (17"/min.) Peak temps were reached in
Electronics Forum | Thu Jun 02 11:01:28 EDT 2005 | davef
Xilinx recommended reflow ||Sn-Pb Eutetic||Sn-Pb Eutetic ||Pb-Free||Pb-Free Profile Feature||Large Body||Small Body||Large Body||Small Body Average ramp-up rate (TL-TP), *C/seconds max||3||3||3||3 Preheat - Temperature Min (Tsmin), *C||100||100||150|
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100 yamaha economical chipmounter Product number: YV100 Products in detail YAMAHA multi-function chip mounter YAMAHAYV100A Substrate size: ATS20 (end to put) W - ATassembly: L460 * W250 (Max)/L50 * W50 (Min) Substrate thickness: 0.4
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate t
Industry News | 2013-07-20 08:30:51.0
IPC North American EMS Market Report released this month by IPC — Association Connecting Electronics Industries®.
Industry News | 2021-07-19 16:29:30.0
IPC's national hand soldering competitions return to Europe this year with events scheduled in France, Estonia, and Germany. Although the 2021 IPC Hand Soldering World Championship was canceled due to ongoing pandemic concerns, skilled competitors in Europe will participate in national competitions at scheduled live tradeshows.
Parts & Supplies | Pick and Place/Feeders
Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p
Parts & Supplies | General Purpose Equipment
FEATHERS 1. Efficiency, collect data continuously for 16 times and forward to computer to analysis grouping; 2. It is available base on PC (WINDOWS) and PDA(Pocket) to analyze; 3. Low power, use lithium battery that can k
YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
YAMAHA placement machine-YS24 equipment parameters: 1. Target substrate: L50×W50mm～L700×W460mm 2. Mounting capacity: 72,000CPH (0.05sec/CHIP) 3. Mounting accuracy: ±0.05mm(μ+3σ), ±0.03mm(3σ) 4. Target
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support
Some key points you may find relevant to this job opportunity include: Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments. Provide solution to custom
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf
Heller Industries Inc.
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. Poor solder joint fillet -- ramp up too slow The flux lost its activity once it stayed soaking too long. Reflow zone (above 217°C ~220°C for SAC305 solder paste
