Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2021-12-21 14:45:26.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.
Industry News | 2023-09-25 14:05:43.0
MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:
Industry News | 2022-04-13 10:22:58.0
MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | Pick and Place/Feeders
Product number: YSI- v Products in detail Object substrate: L50 W50mm ~ L330 W360mm xx (1) does When using standard components: absoluteaccuracy (including + 3 sigma) : + / - 0.05 mm/QFP Repeat accuracy (3 sigma) : + / - 0.03mm/QFP SMT capacity:
Parts & Supplies | Semiconductor & Solar
JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr
