The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
Packed with innovative placement and vision technologies, Assembleon provides optimum flexibility for any medium/high-volume production environment. When speed is not the main priority... But feeder positions and component range are Opal-XII is the
Electronics Forum | Sun Apr 22 23:46:28 EDT 2001 | z1040223
Hello all My company is getting ready to implement solder bump flip chips in the production line in the future. We are a contract manufacturer. We currently have the SMT facilities to do up to 1.5mm pitch BGA's, 0402 and other standard SMT. What equ
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Used SMT Equipment | Pick and Place/Feeders
Unique, Flexible and Ultra Precise for Die Attach, Flip Chip and Standard SMT Placement. Component Size: 20mm x 26.5mm (Laser Recognition) 1.0mm x 0.5mm to 20mm Square (Vision Recognition) Fixed Front & Rear Feeder Banks (Optional Trolley Upg
Used SMT Equipment | Pick and Place/Feeders
Universal GSM2 with maximum upgrades to replicate the GX-11 capabilities at a fraction of the cost. Basically a one machine factory. Some features are: * 7 Spindle FlexJet head on Beam 2 * 4 Spindle FlexHead on Beam 1 * UPS+ Windows software
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
http://www.pcb-separator.com/plus/view.php?aid=86 ??????????? ???????? ????/LED separating/LED panel separating/PCB depaneling device/???????/online separating
http://www.pcb-separator.com/plus/view.php?aid=86 LED production line cutting machine, this separator can connect your production line. we specializing the PCB assembly line and SMT solution.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=4
DELAMINATIONS Nordson SONOSCAN SOJ Lead and Paddle Delaminations - Application Note 2250 VOIDS AND BOND DEFECTS Nordson SONOSCAN Flip Chip Underfill Void and Solder Bump Defects - Application Note 1016
| http://etasmt.com/cc?ID=te_news_industry,26561&url=_print
. Basically, when placing components the spindles typically drive at maximum velocity and acceleration for much the Z-travel. At set distance above board height the machine control software transitions the spindle into a slew mode with a controlled deceleration and reduced velocity