3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160 Equipment overview The 3D X-ray inspection system ML-MirXT-160 is specially tailored for wafer technology, SMT, packaging inspection, semiconductor and laborator
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
Used SMT Equipment | Pick and Place/Feeders
Unique, Flexible and Ultra Precise for Die Attach, Flip Chip and Standard SMT Placement. Component Size: 20mm x 26.5mm (Laser Recognition) 1.0mm x 0.5mm to 20mm Square (Vision Recognition) Fixed Front & Rear Feeder Banks (Optional Trolley Upg
Used SMT Equipment | Pick and Place/Feeders
Universal GSM2 with maximum upgrades to replicate the GX-11 capabilities at a fraction of the cost. Basically a one machine factory. Some features are: * 7 Spindle FlexJet head on Beam 2 * 4 Spindle FlexHead on Beam 1 * UPS+ Windows software
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=4
DELAMINATIONS Nordson SONOSCAN SOJ Lead and Paddle Delaminations - Application Note 2250 VOIDS AND BOND DEFECTS Nordson SONOSCAN Flip Chip Underfill Void and Solder Bump Defects - Application Note 1016
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. Basically, when placing components the spindles typically drive at maximum velocity and acceleration for much the Z-travel. At set distance above board height the machine control software transitions the spindle into a slew mode with a controlled deceleration and reduced velocity
