Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
Advanced Solder Paste Printer with 2D and 3D SPI On-Board Standard Features Include: 3D Solder Paste Inspection 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Full Process Control Programmable
New Equipment | Cable & Wire Harness Equipment
Overview Microscope for visual analysis of cross-sectional images of crimped connections. Precise results in real-time Simple connection and installation with standard PC Clear illumination with LED ring light Analysis according to
New Equipment | Fabrication Services
PCB Manufacturing Capabilities Items Fabrication Capabilities Remarks Layer Count 2-28 layers If your PCB order is over 28layers, please contact your customer service for quotation. Material FR-4 94V0/ Alum
Layer Count: 2L Board Thickness: 0.8mm Dimension: 140*85mm Material: Rogers RO5880 Surface Copper: 35μm Min Hole Diameter: 2.0mm Min line Width/Space: N/A Surface Finish: ENIG Do you need a PCB for special signal requirement into your products? High
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
New Equipment | Test Equipment
100MHz Digital Phosphor Oscilloscope The TDS 3000 oscilloscopes are the lowest priced, most portable Digital Phosphor Oscilloscopes (DPOs). Now every design engineer and technician can take advantage of the tremendous benefits of DPOs. DPOs deliver
