Used SMT Equipment | Repair/Rework
ONYX 29 KEY FEATURES SUMMARY: AXIS MOVEMENTS: All 7 axis motorised, closed loop motion control MANUALMOTION: via integrated hand wheels PC: With Windows based software. UP TO 8 THERMOCOUPLE PORTS: to control process temperatures. AUTOMATIC SIT
Industry News | 2020-07-09 18:39:47.0
Seika Machinery, Inc. introduces the Malcom SWB-2 Wetting Balance Tester. The entire procedure from flux application (with flux temperature control function) to measurement end is automated.
Industry News | 2010-04-11 03:03:34.0
KREUZWERTHEIM, GERMANY - SEHO Systems GmbH announces that it has been awarded an NPI Award in the category of Soldering-Wave for its Fluxer Control. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2009-06-30 02:47:27.0
SEHO, a leading manufacturer of soldering systems, sets a new milestone for the control of automized selective soldering processes.
Technical Library | 2015-02-27 16:46:30.0
During the last period of newly assembled electrical devices (pcbs), new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements based on the automotive and industrial industry. In the narrow gaps under components, residues can accumulate more by the capillary forces. This is not that much a surface resistance than an interface issue. Also that the flux residues under such types of components creates interaction with the solder resists from the pcb, as well as the component body was not completely described in the standard SIR measurement. On the other hand also, electrical influence with higher voltage creates new terms and conditions, in particular the combination of power and logic in such devices. The standard SIR measurement cannot analyze those combinations.The paper will discuss the requirements for a measurement process, and will give results. The influences of the pcb and component quality will also be discussed. Furthermore it will describe requirements for nc solder paste to increase the chemical/thermical/electrical reliability for whole devices
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PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Industry News | 2015-04-22 17:49:20.0
Kurtz Ersa North America introduces its new Digital Position Setup Tool. The tool has been designed primarily for use on Ersa selective soldering machines such as the VERSAFLOW 3, VERSAFLOW 4050 and VERSAFLOW 5060 models.
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Technical Library | 1999-06-23 20:29:21.0
This paper outlines the harmful effects of out-of-control process parameters and describes methods of measuring and tracking them to keep them in control. It addresses all critical variables of wave soldering: flux deposition, preheat application, conveyor speed, solder temperature and solder contact time.
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
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