Application: 3D Vision Measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer
Industry News | 2016-10-20 19:12:21.0
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium at the Crowne Plaza Midtown in Atlanta, GA from November 29 to December 1, 2016.
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Industry News | 2017-05-30 19:40:07.0
The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.
JUKI FX-3RA Modular SMT Chip Shooter ❙ Introduce of JUKI FX-3RA FX-3RA | SMT-JUKI / surface mount technology system, high speed compact modular JUKI pick and place machine, JUKI mounter, JUKI chip shooter, improve production efficiency. ❙
Industry News | 2008-05-18 00:07:34.0
MINNEAPOLIS, MN � The SMTA is pleased to announce Edward Zoiss as the keynote speaker for the AIMS Harsh Environment Electronics Workshop. The workshop will be co-located with SMTA International at Disney's Coronado Springs Resort and Convention Center in Orlando, Florida on August 18-19, 2008.
Industry News | 2008-09-02 15:34:36.0
Minneapolis, MN � The 2008 Charles Hutchins Educational Grant recipient, Lei Nie, a graduate student in the field of Mechanical Engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process".
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2017-08-16 17:35:27.0
Count On Tools is pleased to announce that with the recent expansion of its manufacturing facility, the company has purchased and installed two DMG NHX-4000 horizontal milling centers to further increase production capabilities and lower product lead times. The new equipment expands COT’s current capabilities into more complex parts that can be manufactured with significant costs savings to the end-user.
Industry News | 2019-08-12 20:12:26.0
IPC E-Textiles 2019, a two-day technical education workshop for innovators, technologists and OEMs/brands to learn about the latest developments, designs and manufacturing concepts in the converging industries of textiles and electronics, will feature 14 technical presentations, tours of the Drexel Center for Functional Fabrics, a special interactive session and an IPC D-70 E-Textiles Committee Standards meeting. IPC E-Textiles will take place at the Drexel University Center for Functional Fabrics in Philadelphia, Pa., September 10-11.
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