New Equipment | Solder Materials
Kapp Eco-Babbitt coatings are applied to capacitors as a protective coating; • To shield against electromotive force (EMF) and electromagnetic interference (EMI) with the specified performance of the capacitor; • To prevent current and charge leaka
New Equipment | Solder Materials
Proposal Pro Contra Vaporphase OT2 SCAN-Ge XF3+ Large melting range Anti-Tombstoning Dull solder joints
New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
Technical Library | 2021-08-25 16:34:37.0
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.
Industry News | 2012-02-23 15:21:25.0
The Institute of Material Physics in Space, based in Cologne, Germany, is focused on researching material properties and related subjects. This includes gaining a precise understanding of processes that occur as metals melt. During these experiments, X-ray radiography has allowed research scientists to record the entire process from melting to solidification, providing the diffusion in the molten mass to be directly depicted. Irradiation of the test sample with 110 kV X-ray radiation was accomplished by Viscom’s HIBIX X-ray tube, which was developed specifically for this purpose.
Industry News | 2015-08-20 12:02:27.0
Graco will highlight its new InvisiPac® GM100 Plug-Free™ Hot Melt Applicator and LineSite™ Remote Monitoring Solution at Pack Expo 2015. The GM100 offers all the benefits of plug-free adhesive dispensing in a compact design, while LineSite reduces adhesive costs and boosts production in packaging industry applications through remote system monitoring.
Technical Library | 2013-01-05 22:21:01.0
More and more countries legislate to forbib lead usage in solder material. However, the lead-free solder wire has higher melting point and soldering temperature, increase soldering iron temperature may damage the PCB or components. How to solve this problem?
Technical Library | 2023-02-13 19:04:25.0
The tin whisker phenomenon is a failure mode associated with all electronic devices that use a number of low melting point elements (e.g., Sn, Cd, In) in operations such as soldering. Recognized many years ago, the problem was minimized by adding lead, now identified as a hazardous substance and banned
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
