Technical Library | 2023-10-09 16:10:02.0
This document provides high-level PCB design, sensor mounting, and handling guidelines for TDK IMU devices, which incorporate a combination of gyroscopes and accelerometers. Each sensor has specific requirements to ensure the highest performance in a finished product. For a layout assessment of your design, including placement and estimated temperature disturbances, please contact TDK. The TDK IMU devices discussed in this document (ICM-40607x, ICM-40608, ICM-42xxx, ICM-43xxx, and ICM-45xxx products) consist of 3-axis MEMS gyroscopes and 3-axis MEMS accelerometers.
Industry News | 2010-08-18 19:35:18.0
Multitest, the market leader for MEMS test and calibration equipment, sees great opportunities for the MEMS industry in Asia. Alex Chen, Taiwanese Regional Manager, recently became a member of the Semi Taiwan MEMS Committee to actively contribute to the success of the Asian MEMS industry.
Technical Library | 2010-06-24 21:20:05.0
Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm#2;173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost.
Industry Directory | Manufacturer
Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.
Next Scheduled Public Courses: July 17, 2008 ~ San Francisco, CA September 19, 2008 ~ Dallas, TX November 6, 2008 ~ San Jose, CA This introductory course is designed to educate people from any background on the exciting new technologies and mark
Industry Directory | Manufacturer
Trion provides versatile plasma equipment (ICP-RIE, PECVD, PVD, Ashers, and more) to enable our customers in the MEMS, Semiconductor, LED, RF Power, F.A., Opto-, III-V, Wafer Level Packaging, Thin Film Head, and Solar industries.
Industry Directory | Consultant / Service Provider / Manufacturer
Microtek focuses on optimum microelectronics packaging solutions from prototype to production for applications in: Die Attach, Die Sorting, Flip Chip, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, RFID..
Technical Library | 2018-12-19 21:23:59.0
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste.
Used SMT Equipment | In-Circuit Testers
Yokogawa DL708E Bandwidth: 410 Mhz Channels: 8 Yokogawa 701820 DL708E Digital Oscilloscope, 8 Ch, 100k/Ch Mem The Yokogawa 701820 oscilloscope is a graph-displaying device - it draws a graph of an electrical signal. In most applications, the
Used SMT Equipment | In-Circuit Testers
Yokogawa DL708E Bandwidth: 410 Mhz Channels: 8 Yokogawa 701820 DL708E Digital Oscilloscope, 8 Ch, 100k/Ch Mem The Yokogawa 701820 oscilloscope is a graph-displaying device - it draws a graph of an electrical signal. In most applications, the
