03001807-01 MAGAZINE FOR NOZZLE TWIN HEAD 03001828-01 Combi-cable mount complete 03001829S01 Flat ribbon cable mount FCM3 03001830-01 CABLE HOLDER 03001846S03 CAMERA VISUAL SHIELD TWIN HEAD 03001848-01 Cover, Headboard Sx/Fx 0
03001807-01 MAGAZINE FOR NOZZLE TWIN HEAD 03001828-01 Combi-cable mount complete 03001829S01 Flat ribbon cable mount FCM3 03001830-01 CABLE HOLDER 03001846S03 CAMERA VISUAL SHIELD TWIN HEAD 03001848-01 Cover, Headboard Sx/Fx 0
03001807-01 MAGAZINE FOR NOZZLE TWIN HEAD 03001828-01 Combi-cable mount complete 03001829S01 Flat ribbon cable mount FCM3 03001830-01 CABLE HOLDER 03001846S03 CAMERA VISUAL SHIELD TWIN HEAD 03001848-01 Cover, Headboard Sx/
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
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