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Nordson ASYMTEK's Forte™ Series Increases Fluid Dispensing Precision, Accuracy, and Throughput

Industry News | 2019-08-21 16:17:24.0

Nordson ASYMTEK introduces its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.

ASYMTEK Products | Nordson Electronics Solutions

SMTA Announces Pan Pacific Symposium Call for Participation

Industry News | 2003-05-27 08:13:23.0

The Ninth Annual Pan Pacific Microelectronics Symposium

Surface Mount Technology Association (SMTA)

SMTA International to Feature Seventeen New Courses

Industry News | 2003-05-30 07:52:35.0

New courses on today's most important topics in electronics manufacturing, assembly, and related business issues

Surface Mount Technology Association (SMTA)

SMTA Announces International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Industry News | 2010-02-01 13:36:36.0

Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.

Surface Mount Technology Association (SMTA)

SMTA Announces Pan Pacific Symposium Call for Papers

Industry News | 2010-05-30 23:23:13.0

Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.

Surface Mount Technology Association (SMTA)

SMTA Announces 7th International Wafer-Level Packaging Conference (IWLPC) Program

Industry News | 2010-06-28 16:44:36.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Registration is now available on-line. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

Pan Pacific 2011 Call for Abstracts

Industry News | 2010-08-17 13:31:00.0

The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)


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