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Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2010-09-02 11:07:09.0

The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

Medical Electronics Symposium Program Finalized

Industry News | 2011-07-14 11:21:39.0

SMTA and MEPTEC announce the program is finalized for the two-day symposium titled "2011 Medical Electronics Symposium - Vital Technologies for Health" and registration is now open. The event will be held September 27-28, 2011 at Arizona State University in Tempe, AZ.

Surface Mount Technology Association (SMTA)

Expanded Roadmap Track Announced For 2012 Pan Pacific Symposium

Industry News | 2011-07-14 11:46:04.0

SMTA is pleased to announce the expansion of the International Electronics Industry Roadmap track at the 2012 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Resort in Kauai, HI, 14-16 February.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2011-07-20 14:49:09.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK Wins Global Technology Award for NexJet Dispensing System with Genius Jet Cartridge

Industry News | 2012-11-29 17:00:57.0

Makes the jetting process faster, easier, smarter, and reduces cost of ownership

ASYMTEK Products | Nordson Electronics Solutions

International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Industry News | 2015-04-07 15:57:40.0

SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

Surface Mount Technology Association (SMTA)

SMTA International, Sensors Midwest to Co-locate

Industry News | 2016-02-17 17:38:34.0

The Surface Mount Technology Association and Questex LLC announced today the finalized agreement to co-locate the SMTA International Conference and Exhibition (SMTA International) with Sensors Midwest.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2017-08-29 15:41:30.0

The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

2019 JoAnn Stromberg Scholarship Winner Announced

Industry News | 2019-09-21 04:09:05.0

We are pleased to announce, Kim Porter, Lorain County Community College (LCCC), has been selected as the winner of the 2019 Joann Stromberg Student Leadership Scholarship.

Surface Mount Technology Association (SMTA)

2022 Stromberg Student Leader Scholarship Recipient Announced

Industry News | 2022-10-20 07:10:40.0

SMTA is pleased to announce Emily Williams, Lorain County Community College, has been selected as the recipient of the 2022 JoAnn Stromberg Student Leader Scholarship.

Surface Mount Technology Association (SMTA)


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