Full Site - : mems test (Page 6 of 20)

Multitest InStrip® - Continuously growing installed base: Reliable high parallel handling solution for a broad range of applications

Industry News | 2012-04-10 16:15:40.0

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that the InStrip® provides a high parallel test handling solution not only for ASICS and sensors in strips

Multitest Elektronische Systeme GmbH

Multitest Sensor Test Modules Ready for Increased Productions Needs Optimizing 6DOF Gyro Test of Singulated Packages

Industry News | 2018-03-13 16:40:22.0

Multitest has been the market leader for MEMS/sensor test and calibration equipment for more than 15 years. Multitest has now launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even lower cost of test, enhanced test accuracy and higher daily output.

Multitest Elektronische Systeme GmbH

Next-Generation Test Equipment For High-Volume Wafer Production

Technical Library | 2010-06-23 21:59:03.0

Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area.

SPIE - International Society for Optical Engineering

Multitest’s InCarrier™ Provides Reliability and Best Cost of Test

Industry News | 2010-02-08 12:06:53.0

Rosenheim, February 2010: Multitest received the first multi-system order for the new InCarrier™ handler by a European IDM. The systems will be used for high-parallel test of small MEMS sensors.

Multitest Elektronische Systeme GmbH

Test in Carriers: New Customer for the Multitest InCarrier®

Industry News | 2011-06-07 15:02:59.0

Multitest has received another order for its unique InCarrier® test equipment from a major test house in Asia. The InCarrier® was preferred against standard singulated package test as well as other methods of high parallel test.

Multitest Elektronische Systeme GmbH

Advances in Thin, 3D and MEMS Die Bond Strength Testing

Industry News | 2017-08-02 07:12:18.0

As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:

XYZTEC bv

Creating True Value with Multitest at VOICE 2013

Industry News | 2013-03-28 11:03:15.0

Multitest, will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.

Multitest Elektronische Systeme GmbH

Advanced Technology Marketing, Inc.

Industry Directory | Distributor / Manufacturer / Manufacturer's Representative

We are Massachusetts based Manufacturer's Representative Company that provides application engineering and technical sales support in New England.

Multitest at Test Vision 2020: Minimize Cost of Calibration and Test for Sensors

Industry News | 2013-06-25 11:29:47.0

Multitest, announces that Klaus Ruhmer will present at Test Vision 2020, in conjunction with SEMICON West, scheduled to take place July 10-11, 2013 at the San Francisco Marriott Marquis.

Multitest Elektronische Systeme GmbH


mems test searches for Companies, Equipment, Machines, Suppliers & Information