Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
New Equipment | Test Equipment
Agilents InfiniiVision MSO7104A, equipped with a 12.1 XGA display, comes in a quiet package that is just 6.5 deep, and weighs only 13 pounds. With the worlds fastest uncompromised update rate, up to 100,000 waveforms per second, see subtle signal det
Industry News | 2011-07-13 15:34:21.0
Multitest announces that Reinhart Richter has been promoted to President of the Multitest Group effective immediately.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2013-05-14 18:28:15.0
Cloud computing, sustainability & recycling, and the explosive growth of MEMS & sensors are among leading trends
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Contact|Mac Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ===>Contact|Mac ✦Product Overview✦ 2707L40P2 DISCONTINUED BY MANUFACTURER DTAM PLUS OPERATOR INTERFACE TERM LCD DISPLAY
Industry News | 2017-03-08 19:49:16.0
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.
Industry News | 2013-06-18 14:58:13.0
Multitest, announces that James Quinn will present during the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.
.jpg)