Industry Directory | Training Provider / Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing
Used SMT Equipment | SMT Equipment
Product Name: Samsung EXCEN-PRO Product number: Samsung EXCEN-PRO Detailed product introduction Samsung EXCEN-PRO high speed chip mounter parameters EXCEN is equipped with 16 suction nozzles, rotary head of the high-speed modular chip mounter, it
Used SMT Equipment | SMT Equipment
Product Name: Samsung EXCEN-PRO Product number: Samsung EXCEN-PRO Detailed product introduction Samsung EXCEN-PRO high speed chip mounter parameters EXCEN is equipped with 16 suction nozzles, rotary head of the high-speed modular chip mounter, it
Industry News | 2013-01-16 19:22:48.0
GPD Global will exhibit in Booth #2633 at the upcoming IPC APEX EXPO. Live demonstrations will be given for a number of systems from the company's dispensing line.
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2021-09-02 08:17:07.0
We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser. See more on stencils here: http://www.soldertools.net/categories/Metal-Stencils/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Oct 14 18:30:00 UTC 2024 - Wed Oct 16 18:30:00 UTC 2024 | ,
GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Beverly, Massachusetts USA | Sales/Marketing
Work with existing sales staff on the following: Follow-up on sales leads, discuss key product features with prospective customers, and log & submit questions to engineering. Research potential customers and determine how our products would fit t
Career Center | Montrose, California USA | Management,Production,Quality Control
Micro/sys designs and manufactures embedded board level products. We currently have an exciting opportunity for an experienced SMT manufacturing professional. We are looking for an energized individual to take a leadership position managing our prod
Career Center | San Pablo City, Laguna Philippines | Engineering
-Knowledge in Programming, Troubleshooting, and Maintenance of (SMT) Machines. *Chip Shouter, IC Placer : Fuji CP 642/643, Yamaha YV Series, Pansonic CM 401/402 *Solder Paste Printer : Panasonic SP60, SPPV, Minami MK787 *Reflow : Tamura, Heller, E
Career Center | Bangalore, Karnataka, INDIA, Karnataka India | Engineering,Production,Quality Control,Technical Support
Training, Production of Hybrid MicroCircuits, Process control HMCs and thorough knowledge of Surface MOunt Technology, and ElectroStatic Dischare.
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
specified board, micro-stencil, part, and solder paste to
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GPD Global | https://www.gpd-global.com/co_website/solder-paste-microdot.php
Solder Paste Micro Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
