Full Site - : micro bga process (Page 2 of 481)

GPD Global to Demonstrate PCD Technology at SEMICON West 2011

Industry News | 2011-06-13 17:25:04.0

GPD Global will demonstrate its award-winning Positive Cavity Displacement (PCD) Dispensing in Booth #6186 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.

GPD Global

GPD Global To Demonstrate Automatic Fluid Dispensing Systems and Conformal Coating Equipment at IPC Apex Expo

Industry News | 2019-01-09 21:58:38.0

GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.

GPD Global

The Latest in Automatic Fluid Dispensing at IPC APEX EXPO 2024

Industry News | 2024-04-06 00:43:25.0

Live demos at IPC APEX Expo 2024 – Booth 1504 – April 9-11, 2024, Anaheim, CA GRAND JUNCTION, CO USA -- April 2024 -- GPD Global – manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production – will exhibit in Booth 1504 at IPC APEX EXPO 2024 on April 9-11 in the Anaheim Convention Center, CA.

GPD Global

Beau Tech 1 Milprobe

Beau Tech 1 Milprobe

Parts & Supplies | Repair/Rework

The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a

Beau Tech

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.

SMTnet

Package Provides Integrated Hall-effect Solution

Industry News | 2003-05-30 08:09:11.0

A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.

SMTnet

What's happening at MIRTEC in 2008?

Industry News | 2008-03-25 23:53:54.0

Comment from Brian D�Amico, President

MIRTEC Corp


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