Full Site - : micro join (Page 11 of 26)

Nihon Superior Introduces Lead-free Solder Paste for 0402 Metric Chip Components

Industry News | 2009-03-05 15:03:01.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.

Nihon Superior Co., Ltd.

Nihon Superior President to Participate in NEPCON China Reflow Optimization Roundtable

Industry News | 2012-04-21 09:00:24.0

Nihon Superior, a supplier of advanced soldering materials to the global market is proud to announce that its President Tetsuro Nishimura has been invited to participate in a Roundtable discussion, “Optimizing Reflow of Lead-Free Boards and BGAs,” hosted by EMSNow.

Nihon Superior Co., Ltd.

The Murray Percival Company Will Offer Live On-Site Demos of Essemtec’s Solder Paste Jetting Technologies and SMD Storage Systems

Industry News | 2015-10-06 19:21:09.0

Essemtec today announced that The Murray Percival Company will hold an open house from Oct 20-22, 2015 at its facility. The Murray Percival Company will offer live on-site demonstrations of new solder paste jetting technologies and fully automated SMD storage systems from Essemtec.

ESSEMTEC AG

Essemtec to Exhibit New Outstanding 3D Assembly and Jet Printing Solutions at productronica 2015

Industry News | 2015-10-21 20:47:59.0

Essemtec today announced that it will exhibit in Hall A3, Booth 346 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Essemtec will display technical innovations in 3D assembly and jet printing with live demonstrations.

ESSEMTEC AG

Essemtec’s outstanding 3D jet printing and 3D assembly solutions created great attention at productronica 2015

Industry News | 2015-12-08 20:27:18.0

Essemtec recently exhibited exceptional 3D jet printing and 3D assembly solutions at productronica 2015. Additionally, Essemtec presented an integrated work cell especially suitable for manufacturers who have to handle frequent product changes.

ESSEMTEC AG

Essemtec Will Exhibit 3D Assembly and Jet Printing Solutions at APEX

Industry News | 2016-02-17 16:46:28.0

Essemtec today announced that it will exhibit in Booth #962 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Essemtec will display technical innovations in 3D assembly and jet printing with live demonstrations.

ESSEMTEC AG

JH Technologies Launches JH Analytical Lab Services and Offers Complementary Sample Processing

Industry News | 2020-05-28 20:21:20.0

JH Technologies, leading distributor of optical and digital imaging systems, materials preparation, testing and analysis systems, and metrology tools announces that it recently opened JH Analytical Lab Services at the company's headquarters in Fremont, California.

JH Technologies

Austin American Technology Welcomes Justin Cody Worden as Director of Business Development

Industry News | 2020-07-22 04:19:52.0

Austin American Technology (AAT) is pleased to welcome Justin Cody Worden as its new Director of Business Development. In his new role, Worden will oversee the Sales & Marketing Divisions while working closely with AAT's North American product representatives and distributors.

Austin American Technology

Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe

Industry News | 2022-05-18 13:01:33.0

Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.

Heraeus


micro join searches for Companies, Equipment, Machines, Suppliers & Information