A division of Palomar Technologies, MicroJoin designs and manufactures systems for ACF & Heat Seal Bonding, Reflow Solding with Patented Ceramic Hot Bar Technology, Equipment for Resistance Micro-Welding & TIG Welding for High Precision Metal Joining
The 907 micro Placer series allows you to place and rework BGA, mBGA, QFP, and Flip-Chip devices quickly and accurately. This unit is quick and accurate for placing devices with the added option of built in rework. You can place and reflow devices w
Forced Convection Reflow systems for curing, drying and solder reflow.
Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Used SMT Equipment | AOI / Automated Optical Inspection
Hardware composition: Ring LEDs (R, G, B) Image resolution 20µm Fixed shape, fixed substrate Single-phase power supply 100 to 240VAC ±10% The weight is below 500kg Equipment dimensions: 700W×900D×1600H mm (height
Used SMT Equipment | Soldering - Reflow
BTU PYRAMAX98A Reflow Oven (Air) with Enhanced Cool 08/2005 Air Only Programmable Width Adjust Edge Rail Center Board Support with Hide Away Option SMEMA 3'' Tunnel Clearance Light Tower (ready/not ready) Closed Loop Convection Control Flux
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2015-10-28 15:22:47.0
EMS provider Micro Industries in Westerville, Ohio will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on December 1, 2015 and the closing will begin at 11:00am EST on December 3, 2015
Parts & Supplies | Pick and Place/Feeders
Yamaha KHY-M7770-A0X Nozzle 306A 317A Yamaha Nozzle Yamaha KHY-M7770-A0X Nozzle 306A 317A Usage:Yamaha pick and place machine Product description: Yamaha KHY-M7770-A0X Nozzle 306A 317A ZK Electronic Supply Other YAMAHA SMT PARTS: Yamaha KHY
Parts & Supplies | Pick and Place/Feeders
Yamaha Nozzle 306A 317A Yamaha Nozzle Yamaha KHY-M7770-A0X Nozzle 306A 317A Usage:Yamaha pick and place machine Product description: Yamaha Nozzle 306A 317A ZK Electronic CAN Also Supply Other YAMAHA SMT PARTS: Yamaha KHY-M7750-A0X SMT Nozz
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | Detroit Metro area, Michigan USA | Engineering,Maintenance,Production,Technical Support
Technicians from entry level to senior level pro's. Prefer experience with one or more of the following OEM Equipment brands. Universal Instruments Speedprint Europlacer SMT (of Germany) Reflow Ovens Sanyo Panasonic DEK
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
Career Center | hyd, andhra pradesh India | Engineering,Production,Research and Development,Technical Support
i have a experience in smt and i acan operate europlacer and mydata machines.
Heller Industries Inc. | https://hellerindustries.com/parts/2583k/
2583K - ENCLOSURE INTERLOCK SWITCH MICRO SWITCH Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8536384-nxt-h08-h12-pick-n-place-machine-nozzle-assembly-1-8m-melf-nozzles-aa19g00.html
NXT H08/H12 Pick N Place Machine Nozzle Assembly 1.8m MELF Nozzles AA19G00 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
