We are a student group at Brown University working to build a low-cost, open-source CubeSat, EQUiSat.
Distribute, buy and sell obsolete components, clone obsolete components like KSY10, develop electronics and software
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
AAMA3535 ANALOG ALARM DIN RAIL MODULE AAMR6436 APOLLO ACCESSORIES ACA10000 ACE10000 ACE20000 ACE30000 ACE40000 ADI INTELLIGENT MESSAGE DISPLAYS ADI2R11A ADI2R11D ADI4T11A ADI4T11D ADI4Y11A ADI4Y11D SIGNAL CONDITIONING DIN RAIL MODULES
Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef
There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
Industry News | 2014-11-25 17:04:36.0
During the 2014 Annual Meeting at SMTA International, the SMTA announced that Christine Taylor, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2014 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages."
Industry News | 2012-06-18 14:49:38.0
Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
Parts & Supplies | Pick and Place/Feeders
TCI 8/97 PANA N20930 CONTROL BOARD -> TCI /97 PANA N20931 POWER BOARD -> TCI 8/97 PANA N20933 VR LED BOARD -> TCI 8/97 PANA N209361104 MAIN CPU CARD PANA N20948 MAIN CPU CARD PANA N20949 NC CARD (LA-M00205A) PANA N20959 MMI CARD LA-M00104D+..103E PAN
Technical Library | 2013-01-09 18:31:54.0
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes designed to reduce Z-axis expansion and improve the materials resistance to thermal excursions through primary attach and rework operations have also produced harder resin systems with reduced fracture toughness.
Technical Library | 2022-10-11 20:15:14.0
The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness.
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains SMTnet Express January 9, 2013, Subscribers: 26086, Members: Companies: 9075, Users: 34138 The Application of Spherical Bend Testing to Predict Safe
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/category/ai-spare-parts-1111/page/175?order=list_price+desc
SMT parts Products AI SPARE PARTS Public Pricelist Public Pricelist PHOTO HIMIC ¥ 0.00 0.0 CNY Sensor ¥ 0.00 0.0 CNY SENSOR ¥ 0.00 0.0 CNY MICRO SWITCH ¥ 0.00 0.0 CNY OPTICAL INPUT MODULE
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Continuing his graduate studies 2014 Christine Taylor , Georgia Tech Paper: "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages" Where is she now
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