Electronics Forum | Thu Nov 01 15:14:47 EST 2001 | jacob
Hello, I am trying to convince our design engineer to use micro-vias when he has to locate them in the middle of a pad. I heard of the use of micro-vias on this site and was wondering if someone could lead me in the direction of somewhere
Electronics Forum | Fri May 10 09:07:42 EDT 2002 | xrayhipp
Does anyone know a surefire way to print micro-vias which are centered on BGA pads and also reduces solder ballooning? Would you design a process around two stencils? -- one for the vias themselves and one for the pads. Could you fill all of the vi
Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon
| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow
Electronics Forum | Mon Apr 16 14:33:50 EDT 2001 | dason_c
Consider to use micro via 10 mil or less, it may help to prevent any solder/flux reflow to the other side and affect your next printing operation. Also, solder void need to be under consideration. Dason.
Electronics Forum | Mon Jan 17 19:29:54 EST 2000 | Michael Allen
I'm searching for technical papers on the topic of via-in-pad (through-vias, not micro-vias) -- hopefully with reliability test results. There's been zero response to this question in the past, but I thought I'd ask again. References would be great
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Fri May 10 14:55:59 EDT 2002 | xrayhipp
Pete, thanks for the input. These are microvias and dont go through the pcb -- they are laser cut to various depths into the board and are .006" dia. on gold plated pads. Paul.
Electronics Forum | Fri May 10 17:42:55 EDT 2002 | davef
I don't know �solder ballooning� from a shoebox. So, rather than let this degrade solely into a rant about the evils of via in pad, please get me up-to-speed in jargon.
Electronics Forum | Fri Jan 12 14:29:51 EST 2007 | jax
OSB ??? OSP !!! 1. The longer the soak, the fewer the Voids. 2. The Higher the soak, the fewer the Voids. Options 1 and 2 have downsides. You could call your paste supplier and see if they have a low-void solder paste... most likely formulated fo
Electronics Forum | Fri Mar 04 11:30:46 EST 2005 | Steve
Is anybody using via-in-pad under a BGA successfully? Is this a specialized capability, or do most board houses have the capability to do micro-via's? How small does the via need to be in order to avoid solder wicking? I understand that in order for
