Industry News | 2003-07-09 09:00:46.0
He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.
Industry News | 2021-11-08 09:27:12.0
Baja Bid will be liquidating excess and unused assets via online auction. The bidding for this event will open promptly at 8:00am EST on November 11th and the closing will begin at 1:00 pm EST on November 17th.
Industry News | 2021-11-11 10:56:53.0
Baja Bid is liquidating excess and unused assets from CASE Assembly via online auction. The bidding for this event is now open and the closing will begin at 1:00 pm EST on November 17th, 2021.
Industry News | 2021-11-17 09:28:16.0
Baja Bid is hosting an online auction event featuring surplus equipment from CASE Assembly. Universal Instruments, DEK, Heller and much more. The bidding period will begin closing today at 1pm EST.
Industry News | 2023-07-03 19:53:40.0
See equipment demonstrations for semiconductor packaging, and talk to Nordson experts in booth E4617
Events Calendar | Mon Feb 10 00:00:00 EST 2020 - Thu Feb 13 00:00:00 EST 2020 | The Big Island of Hawaii, Hawaii USA
Pan Pacific Microelectronics Symposium
Events Calendar | Mon Jan 30 00:00:00 EST 2023 - Thu Feb 02 00:00:00 EST 2023 | Kauai, Hawaii USA
Pan Pacific Microelectronics Symposium
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Industry News | 2013-01-02 15:53:13.0
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
