Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Industry News | 2013-01-02 15:53:13.0
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Technical Library | 2019-05-31 14:21:59.0
Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware.
Events Calendar | Tue Jun 11 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Nuremberg, Germany
SMTA at the SMTconnect
Events Calendar | Mon Jan 31 00:00:00 EST 2022 - Thu Feb 03 00:00:00 EST 2022 | Honolulu, Hawaii USA
Pan Pacific Microelectronics Symposium
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
Inline UV PCB Laser Depaneling Machine Inline UV PCB Laser Depaneling Instruction: PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics
Industry News | 2008-06-02 02:00:30.0
MINNEAPOLIS, MN � The 2009 Pan Pacific Microelectronics Symposium will be held on the Big Island of Hawaii from February 10-12, 2008. This event promotes international technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin.
