Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Technical Library | 2019-05-31 14:21:59.0
Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware.
Events Calendar | Tue Jun 11 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Nuremberg, Germany
SMTA at the SMTconnect
Events Calendar | Mon Jan 31 00:00:00 EST 2022 - Thu Feb 03 00:00:00 EST 2022 | Honolulu, Hawaii USA
Pan Pacific Microelectronics Symposium
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
Inline UV PCB Laser Depaneling Machine Inline UV PCB Laser Depaneling Instruction: PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics
Industry News | 2008-06-02 02:00:30.0
MINNEAPOLIS, MN � The 2009 Pan Pacific Microelectronics Symposium will be held on the Big Island of Hawaii from February 10-12, 2008. This event promotes international technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin.
Industry News | 2009-06-04 00:08:36.0
The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
