Career Center | Buffalo Grove, Illinois USA | Engineering,Production
SMT Soldering Surface Mount and Through Hole, hand soldering. Must be experienced in reading parts lists and know how to identify electronics components. Job requires use of a microscope and/or a maginfying glass.
Used SMT Equipment | In-Circuit Testers
JDSU FBP-SM03 Fiber Inspection System Display with FBP Probe Microscope 200/400X Features: Visually inspect bulkhead and patch cord ends of fiber optic connectors Dual Magnification 200/400X Kit Includes: Hardwired 200/400X FBP Probe HD
Used SMT Equipment | In-Circuit Testers
JDSU FBP-SM03 Fiber Inspection System Display with FBP Probe Microscope 200/400X Features: Visually inspect bulkhead and patch cord ends of fiber optic connectors Dual Magnification 200/400X Kit Includes: Hardwired 200/400X FBP Probe HD
Industry News | 2017-04-05 11:18:26.0
Microtronic GmbH is pleased to announce that it has added the PEMTRON PS™ Series Scanning Electron Microscopes (SEMs) to its product line up in parts of the EU. The PS Series Models include the PS-210 Compact Desk Top Mini-SEM, the PS-230 High Performance Normal-SEM, and PS-250 Analytical Normal-SEM.
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
Technical Library | 2015-02-12 16:57:56.0
Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.
Technical Library | 2017-04-20 13:51:14.0
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability.
Industry News | 2022-10-06 18:00:57.0
WPI Vision is pleased to announce plans to exhibit in Booth #1222 at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The company will debut its new 3D SPECTASCOPE – Enhanced Reality Microscope –designed to bring a new dimension of accuracy and speed to electronic assembly and inspection throughout the PCBA Industry. With a range of new patent-pending technologies, 3D SPECTASCOPE sets a new precedent for workstation throughput.
The YSC HD-PAD is the perfect tool for quick and immediate inspection needs. This inspection magnifier provides crystal clear images for the user. Its compact and ergonomic design is comfortable to hold and highly intuitive to use. The display deli
YSC PowerScope US209 is the ultimate digital microscope that can be customized with various camera, lighting, stand, software, and measurement options. The lens offers superior resolution and depth of field with detent click stop feature, which is id
