Full Site - : microscope for cross sectioning (Page 3 of 7)

Datest Receives Global Technology Award for High-end CT Scanning and Failure Analysis Service

Industry News | 2018-10-17 20:20:17.0

Datest announces that it was awarded a 2018 Global Technology Award in the category of Test Services for its High-end CT Scanning and Failure Analysis Service. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International. This is Datest’s fourth Global Technology Award, having previously been the recipient of this prestigious recognition in 2011, 2013 and 2015.

Datest

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2021-10-31 04:57:58.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2022-01-03 07:38:59.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

Applying Microscopic Analytic Techniques For Failure Analysis In Electronic Assemblies

Technical Library | 2021-09-21 20:36:45.0

The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform- Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.

ZOLLNER ELECTRONICS, INC.

Inovar Adds Inspection/Failure Analysis Capability

Industry News | 2009-05-11 11:25:21.0

LOGAN, UTAH � May 2009 � Inovar Inc., a leading contract electronics manufacturer (CEM) dedicated to providing flexible solutions to OEMs in the fastest growing segments of the electronic industry, announces that despite the trying economic times, it has again demonstrated its continual dedication to growing the services offered to the company's OEM partners.

Inovar, Inc.

Material Lab Technician

Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin

Winslow Automation (aka Six Sigma)

JH Technologies Launches JH Analytical Lab Services and Offers Complementary Sample Processing

Industry News | 2020-05-28 20:21:20.0

JH Technologies, leading distributor of optical and digital imaging systems, materials preparation, testing and analysis systems, and metrology tools announces that it recently opened JH Analytical Lab Services at the company's headquarters in Fremont, California.

JH Technologies

Koh Young will be Showcasing its Award-winning Inspection Solutions at electronica on 15-17 November 2022 in Munich, Germany

Industry News | 2022-10-19 13:14:00.0

Alzenau, Germany – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase its award-winning inspection solutions at electronica on 15-17 November 2022 in Munich, Germany. We will present our innovative technologies to a global audience at this leading tradeshow in booth A3.358.

Koh Young America, Inc.


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