Electronics Forum | Wed Feb 02 21:56:11 EST 2005 | davef
Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area. Class III Small: Void area is LT 9% Cla
Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef
Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t
Electronics Forum | Mon Jun 27 07:23:22 EDT 2011 | edmaya33
North star Imaging and Dage CT can do a non destructive cross-sectioning. http://www.4nsi.com/industrial-x-ray-news/large-demand-for-nsi-x-ray-and-ct-systems
Electronics Forum | Thu Sep 06 10:58:49 EDT 2001 | davef
If your words imaged correctly, it seems a bit strange to have a trace that is wider than the pad where it connects, because we�re used to seeing a narrower trace connecting to a wider pad. It�s tough to determine what the designer was thinking abou
Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew
We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C
Electronics Forum | Tue Apr 29 13:14:39 EDT 2014 | hegemon
I hope Dave is saying that your supplier is pulling the wool over your eyes, and not describing the actual event.
Electronics Forum | Thu Apr 15 14:56:43 EDT 1999 | Dave F
| Can anyone suggest or identifiy standards which tabulate the following: | | Conductor width, cross sectional and area conductor thickness for PCB's carrying up to 70 Amps? | Barry: Check: 1 Printed Circuits Handbook (Clyde F. Coombs) 2 Microel
Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef
Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse
Electronics Forum | Thu Jul 17 17:39:08 EDT 2003 | slthomas
If you wanted to use ultrasonics to wash an customer's assembly, and you'd had poor success doing it in the past, would you consider it reasonable for the customer to request that YOU provide cross-sectional image analysis of the first batch of new p
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
