Technical Library | 2021-07-27 14:49:16.0
Conductive anodic filament (CAF) formation, a failure mode in printed wiring boards (PWBs) that are exposed to high humidity and voltage gradients, has caused catastrophic field failures. CAF is an electrochemical migration failure mechanism in PWBs. In this article, we discuss CAF, the factors that enhance it, and the necessary conditions for its occurrence. Published studies are discussed, and the results of historical mean time to failure models are summarized. Potential reasons for CAF enhancement solutions are discussed, and possible directions in which to develop anti-CAF materials are proposed.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
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I. NPI (New Product Introduction) Promex is capable of starting with your schematic and shipping you an electrically tested electronic assembly for your final approval to your specifications. Specific services Promex performs for NPI are: Select par
Used SMT Equipment | In-Circuit Testers
Agilent E4440A-202-B7J PSA High-Performance Spectrum Analyzer The Agilent E4440A PSA high-performance spectrum analyzer measures and monitors complex RF and microwave signals up to 26.5 GHz. With optional external mixing, the frequency coverage
Technical Library | 2015-07-16 17:24:23.0
Qualification of electronic hardware from a corrosion resistance standpoint has traditionally relied on stressing the hardware in a variety of environments. Before the development of tests based on mixed flowing gas (MFG), hardware was typically exposed to temperature-humidity cycling. In the pre-1980s era, component feature sizes were relatively large. Corrosion, while it did occur, did not in general degrade reliability. There were rare instances of the data center environments releasing corrosive gases and corroding hardware. One that got a lot of publicity was the corrosion by sulfur-bearing gases given off by data center carpeting. More often, corrosion was due to corrosive flux residues left on as-manufactured printed circuit boards (PCBs) that led to ion migration induced electrical shorting. Ion migration induced failures also occurred inside the PCBs due to poor laminate quality and moisture trapped in the laminate layers.
Used SMT Equipment | In-Circuit Testers
JDSU HST-3000-DSLR JDSU HST3000 Handheld Tester Portable test set addressing the needs of Layer 1 thru Layer 7 testing with IPv6 Capability Handheld, modular platform for copper and multi-service testing Highlights Support for Electric
Used SMT Equipment | In-Circuit Testers
JDSU HST-3000 JDSU HST3000 Handheld Tester Portable test set addressing the needs of Layer 1 thru Layer 7 testing with IPv6 Capability Handheld, modular platform for copper and multi-service testing Highlights Support for Electrical an
Used SMT Equipment | In-Circuit Testers
JDSU HST-3000-T1-ETH-VOIP-MSO JDSU HST3000 with T1 Module, Ethernet Module, VOIP, & MSO JDSU HST3000 Handheld Tester Portable test set addressing the needs of Layer 1 thru Layer 7 testing with IPv6 Capability Handheld, modular platform for c
Used SMT Equipment | In-Circuit Testers
JDSU HST-3000-T1-ETH-VOIP-MSO JDSU HST3000 with T1 Module, Ethernet Module, VOIP, & MSO JDSU HST3000 Handheld Tester Portable test set addressing the needs of Layer 1 thru Layer 7 testing with IPv6 Capability Handheld, modular platform for co
