Industry News | 2024-07-08 11:04:21.0
IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a Qualified Products Listing (QPL) requalification to IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2010-07-10 08:39:05.0
BEST Partners with MRC to bring customers SMT Metal Stencils
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
Industry News | 2010-07-10 08:36:16.0
Partners with MRC to bring high quality stencils quickly and with an accent on service
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Industry News | 2009-10-17 09:43:47.0
Reduce PCB Repair Costs
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
Industry News | 2019-05-12 15:58:00.0
Fast Shipment of Custom SRT Nozzles
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
