Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/standards
. Document Name Source ESCC 25200 European Space Agency GEIA-STD-0006A SAE J-STD-020 IPC/JEDEC J-STD-033 IPC/JEDEC J-STD-035 IPC/JEDEC J-STD-075A IPC/JEDEC MIL-PRF-123 Defense Logistics Agency MIL-PRF
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7251-3tier-pth-pad-stack-obsolete_topic1463_post5897.html
. An example of this would be: The Nominal Environment annular ring (AR) was set to 8 mils. That means that a 10 mil hole had a 8 mil AR and a 20 mil hole had a 8 mil AR and the 40 mil hole had a 8 mil AR and a 80 mil hole had a 8 mil AR
