Industry News | 2024-06-24 09:31:47.0
IPC releases PCB industry results for May 2024
Industry News | 2024-08-19 16:11:06.0
Forum co-located with IPC Builds, IPC standards development committee meetings
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2010-03-17 18:22:21.0
BANNOCKBURN, Ill., USA, March 16, 2010 — The IPC Intellectual Property Committee will release its first draft of a standard for the protection of intellectual property (IP) designed into printed circuit boards at an open meeting, Tuesday, April 6, 2010, at IPC APEX EXPO® in Las Vegas.
Industry News | 2010-04-11 22:42:40.0
BANNOCKBURN, Ill., USA — In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Jack Bramel, Jack Bramel & Associates was awarded the 2009 IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO™ in Las Vegas, the Hall of Fame Award represents IPC’s highest level of member recognition.
Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Industry News | 2010-04-23 22:02:25.0
BANNOCKBURN, Ill., USA, IPC — Association Connecting Electronics Industries® announces the election of Mel Parrish, FSO and director of training materials, STI Electronics Inc., to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term.
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2011-03-21 12:32:41.0
The IPC Summit on American Competitiveness will be held June 15-16, 2011, in Washington, D.C. at the Hyatt Regency on Capitol Hill. This unique IPC event combines conference presentations with legislative and regulatory briefings as well as key lobbying visits with members of Congress to discuss critical issues that directly impact the U.S. electronics industry’s ability to compete globally. As a part of the two-day Summit, exclusive events with members of the National Association of Manufacturers will offer opportunities to hear from and network with members of Congress and senior-level Administration officials.
Industry News | 2011-03-31 11:42:53.0
According to 2009-2010 IPC Industry Analysis and Forecast for Flexible Circuits in North America, the sales of flexible circuits is forecasted to grow to $50.8 billion globally by 2012. In order to provide the industry with the latest information on this important market segment, IPC — Association Connecting Electronics Industries® will hold the IPC International Conference on Flexible Circuits, June 21-23, 2011, in Minneapolis, Minn.
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