Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2011-03-21 12:32:41.0
The IPC Summit on American Competitiveness will be held June 15-16, 2011, in Washington, D.C. at the Hyatt Regency on Capitol Hill. This unique IPC event combines conference presentations with legislative and regulatory briefings as well as key lobbying visits with members of Congress to discuss critical issues that directly impact the U.S. electronics industry’s ability to compete globally. As a part of the two-day Summit, exclusive events with members of the National Association of Manufacturers will offer opportunities to hear from and network with members of Congress and senior-level Administration officials.
Industry News | 2011-03-31 11:42:53.0
According to 2009-2010 IPC Industry Analysis and Forecast for Flexible Circuits in North America, the sales of flexible circuits is forecasted to grow to $50.8 billion globally by 2012. In order to provide the industry with the latest information on this important market segment, IPC — Association Connecting Electronics Industries® will hold the IPC International Conference on Flexible Circuits, June 21-23, 2011, in Minneapolis, Minn.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2011-09-12 15:42:18.0
For the past year, engineers from companies like Honeywell Aerospace and Rockwell Collins have been meeting to lay the groundwork for IPC-A-630, Requirements and Acceptance for Enclosures, better known as “the box build standard.” These volunteers have come largely from the OEMs that specify the cabinetry they will use.
Industry News | 2012-01-13 13:18:15.0
IPC has filed comments with the U.S. Department of State’s Directorate of Defense Trade Controls (DDTC) urging them to protect the security of U.S. defense equipment by ensuring export control protection of design information for printed circuit boards for defense equipment. IPC strongly recommended that DDTC make clear that International Traffic in Arms Regulations (ITAR) apply to any printed board designs for defense items on the United States Munitions List (USML).
Industry News | 2012-02-10 16:21:39.0
Renowned for the industry’s premier technical conference and courses, IPC APEX EXPO® also includes ample opportunities to learn about industry issues and find solutions free of charge. Exhibits-only registration to IPC APEX EXPO is free to individuals who register in advance and includes access to: inspiring and informative keynote sessions; BUZZ sessions covering key industry topics; the NPL Process Defect Clinic; free special events; and the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test.
Industry News | 2012-05-15 10:31:04.0
IPC Midwest will highlight the new technologies, materials and processes in electronics manufacturing to help engineers solve their challenges and work smarter.
Industry News | 2012-06-18 14:49:38.0
Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA
Industry News | 2013-04-01 14:11:56.0
IPC announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
