New Equipment | Test Equipment
Teradyne’s Spectrum™ 8862 (TSSE) is a unique combinational in-circuit (ICT)/ functional test system that can lower overall costs and test times for manufacturers that prefer to combine functional and ICT test capabilities on a single system. Spectrum
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
Electronics Forum | Thu Sep 24 08:05:59 EDT 2020 | majdi4
In my opinion, it is not possible to eliminate the oxidation in a component because oxidation it is not removable .. the only solution is to apply a mechanical operation (scraping) and then tinning the part..
Electronics Forum | Wed Sep 23 00:06:34 EDT 2020 | SMTA-64387098
I have modules that come with a 4 x 2 pin header. The problem is the pins must be oxidized as they do not take solder (no wetting occurring). This occurs whether solder in our wave soldering machine or soldered by hand. I tried cleaning the module i
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Parts & Supplies | Assembly Accessories
LINEAR-WAY N510040427AA SSR15XV2UUE+605LY-II(00995183G020) JOINT MTNP000832AA M-5H-4-X83 SPACER N510019911AA CB-302E BOLT N510000323AA Hexagon socket button head screw M3X6 Steel Black oxide finish 12.9 Tray Feeder Lift Section:NPM N610069932
Parts & Supplies | Assembly Accessories
PIN N510020600AA MMS4-25 SENSOR N610080223AA GT7SN CYLINDER N610076227AB CDQSBS12-20-DCL7078L CYLINDER N610076228AB CDQSBS12-20-DCL7078L CYLINDER N610082929AB CDQSBS12-20-DCL7078L CYLINDER N610121090AB CDQSBS12-20-DCL7078L CYLINDER N61012
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
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. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types-2020/connectors
, Lebensdauerprüfungen und einzelne Pins können mit einer einzigen Maschine untersucht werden. Es können Kräfte von wenigen Gramm (mN) bis 100 kg (1000 N) aufgebracht werden. Steckverbinder haben aufgrund von
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