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Parts & Supplies | Screen Printers
DEK ORIGINAL NEW 177055 STENCIL ROPE MORE DEK PARTS IN STOCKS DEK STEPPER MOTOR 140452-181245 DEK SPRING SHAFT KIT 145884 DEK SPRING G0332 DEK SOLVENT PUMP ASSY 191088 DEK SOLVENT 183668 DEK SOLENOID VALVE 165431 DEK SINGLE BOARD COMPUTER (
9.jpg)
Parts & Supplies | Screen Printers
DEK ORIGINAL NEW 177055 STENCIL ROPE MORE DEK PARTS IN STOCKS DEK STEPPER MOTOR 140452-181245 DEK SPRING SHAFT KIT 145884 DEK SPRING G0332 DEK SOLVENT PUMP ASSY 191088 DEK SOLVENT 183668 DEK SOLENOID VALVE 165431 DEK SINGLE BOARD COMPUTER (
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Industry News | 2019-10-15 15:04:38.0
A new technical paper that focuses on the application requirements of printing small apertures and the results of a design of experiment testing will be presented at the upcoming Productronica trade fair in Germany. The paper will be presented by Edward Nauss, MPM Applications Engineer at ITW EAE.
Industry News | 2012-01-13 13:27:59.0
The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
New Equipment | Solder Paste Stencils
BEST custom manufactures a vareity of stencils including miniature rework stencils. These stencils are designed to rework specific component locations. These component stencils feature flaps on their sides in order to prevent solder paste form leachi
