Full Site - : miniature stencil (Page 8 of 27)

LED Production Line

LED Production Line

New Equipment | Other

LED Production Line Name: LED production Line Usage: PCB production Type: Semi auto Production time: 30 days Product description: LED Production Line/ SMT Production Line/ PCBA Line (printer+mounter+reflow oven)  INQUIRY LED Product

Flasonsmt Co.,ltd

PCBA Assembly Line

PCBA Assembly Line

New Equipment | Other

PCBA Assembly Line Name: SMT assembly line Usage: PCB production Type: Semi auto Production time: 30 days Product description: PCBA Assembly Line, Usage: PCB production, Type: Semi auto, Production time: 30 days  INQUIRY PCBA Assem

Flasonsmt Co.,ltd

StenTech Awarded for Advanced Nano Coating for Stencil Performance & Precision

Industry News | 2023-10-31 19:19:30.0

StenTech® Inc. today announced that it received an esteemed 2023 Mexico Technology Award in the category of Screen/Stencil Printing Consumables. The award celebrates StenTech's revolutionary Advanced Nano Coating, a groundbreaking technology that sets a new benchmark for stencil performance and precision. The award was announced at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.

Stentech

FINETECH/MARTIN to Host SMTA Boston Chapter Meeting

Industry News | 2010-10-06 11:52:25.0

FINETECH/MARTIN announces that it will host the upcoming SMTA Boston Chapter meeting on Tuesday, October 12, 2010 at its facility in Manchester, NH. Joe Belmonte, Principal Consultant at ITM Consulting, will present "Considerations in Miniature SMT Component Assembly."

Finetech

Study on Solder Joint Reliability of Fine Pitch CSP

Technical Library | 2015-12-31 15:19:28.0

Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.

Flex (Flextronics International)

Size Matters - The Effects of Solder Powder Size on Solder Paste Performance

Technical Library | 2020-10-27 02:02:17.0

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is "when should we switch from Type 3 to a smaller solder powder?" Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented. The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study.

FCT ASSEMBLY, INC.

Kyzen Technology Experts to Present at SMTA Penang 2012

Industry News | 2012-11-08 12:01:36.0

Kyzen, will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.

KYZEN Corporation

See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

Industry News | 2012-01-24 16:23:30.0

FCT Assembly will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo.

FCT ASSEMBLY, INC.

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

LED Assembly Line

LED Assembly Line

New Equipment | Assembly Services

LED Assembly Line Name: SMT assembly line Usage: PCB production Type: Semi auto Production time: 30 days Product description: LED Assembly Line/ SMT Assembly Line/ PCBA Line (printer+mounter+reflow oven) LED Assembly Line Products descri

Flasonsmt Co.,ltd


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