Electronics Forum | Wed Jul 13 09:38:21 EDT 2022 | madisreivik
Page 18 http://www.mpk-pcb.de/en/download/mpk-kemmer-pcb-tools-catalogue-2019/ And maybe try "downforce" EA30-L type, as the cutting path is very short. Short lengths you can cut dry. Just use manufacturers recommended feed/speed and DO NOT reduce
Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Fri Jan 31 00:21:28 EST 2020 | jineshjpr
Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2002 Micro BGA 8Ball Package.
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
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