Electronics Forum | Sat May 08 07:03:31 EDT 2010 | aj
From looking at your images I would say it could be poor solderability on the terminations of the component itself. Can you get your hands on a different date code and try them out?
Electronics Forum | Sat Dec 04 09:42:18 EST 1999 | Chris McDonald
Just as explained in a follow-up you are getting too much paste on the pad. The pad is probably the right size but you cant have your aperature the same size as your pad. What we have done is put a Cross in the stencil. This will reduce the paste and
Electronics Forum | Fri Apr 30 00:20:33 EDT 2010 | sudhir14
We are using QP fuzi m/c during the placement of comp. PCB is fixed & placement head is movable This component is placed at last but still we are getting the problem Comp. is placed with slowest setting also slowest comp. transfer speed of nozzle h
Electronics Forum | Fri Apr 30 07:39:54 EDT 2010 | jdengler
We do a similar part on a Fuji IP3. Set table speed to low. I do not know the QP, but if it's similar to the IP make sure the board clamp/unclamp is smooth. On our IP it got dirty and was jerking causing the board to jump a little which bounced ou
Electronics Forum | Sun May 02 11:36:27 EDT 2010 | jdeluna
I do agree with Jerry: you should apply more paste on it, either with a step stencil, or doing overprint on it by, let's say 120% on Transformer's pad. Also, you need to check : a) there's smooth movement on transport process after the placement, no
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Mon Apr 26 15:48:04 EDT 2010 | markhoch
Sudhir, This part appears to have a lot of mass, thus it may be very heavy. What type of placement machine are you using? Is the PCB held in a fixed place on the table while the gantry moves in the X and Y? Or does the PCB move in the X and Y while t
Electronics Forum | Wed May 05 15:27:06 EDT 2010 | bradlanger
Make sure that both lead frames are contacting the PCB pads when the part is on the placement head. We had an SM xfrmer that we were handling with vacuum by a ferrite cap that was not glued on straight. The part would contact one set of pads and get
Electronics Forum | Tue Oct 09 10:28:48 EDT 2012 | swag
Awesome! Glad to help.
