Events Calendar | Tue Jun 13 00:00:00 EDT 2017 - Tue Jun 13 00:00:00 EDT 2017 | Rolling Meadows, Illinois USA
Webinar Class III -The Deadly Sins of SMT Assembly
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Machine for in-line and off-line http://www.selen.hr/pokaz_kategorie.php?cid=437
Industry News | 2020-12-11 20:33:25.0
SunzonTech give fresher a short introduction of a full automatic solder paste printer's working process. It is really benefit for a fresher. Take a look at it!
Industry News | 2013-02-25 16:44:53.0
MYDATA has recently completed successful testing of a new low-temperature solder paste for jet printing.
The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder
Used SMT Equipment | SPI / Solder Paste Inspection
Parmi Hs60 SPI ON LINE for sale (90% of new ) .GOOD PRICE .Don't hesitate, Let's hurry!
