Electronics Forum | Thu Jun 28 09:57:50 EDT 2012 | mosborne1
blow holes and via holes are almost always caused by moisture and in PTH they could be moisture and improper drilled holes. If you are seeing solder balls next to the parts than I would say you have a reflow profile problem. Are you using any kind of
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Industry News | 2017-04-13 17:29:30.0
Saki Corporation will demonstrate the advanced capabilities and new extra component detection (ECD) feature of its BF-3Di 3D automated optical inspection (AOI) systems at NEPCON China on April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center in Shanghai, China, in booth 1J25.
Industry News | 2010-06-10 09:01:42.0
Siplace Software Suite maps all areas of SMT production as transparent, consistent process.
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
The Role of PCB Assembly in the Internet of Things (IoT) Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
. Fill Pass Patterns Fillet Pass Depending on die size, this pass could be all the material required to complete the underfill. Once the material is dispensed, it flows under the flip chip via capillary action
