Electronics Forum | Wed Sep 01 05:44:18 EDT 1999 | Wolfgang Busko
| | I'm in univerity research on SMT assembly systems. Especialy Simulation and Optimisation using OR-Methods. We developed flexible simulation models of various assembly-machines and use them for performance estimation (Components per hour) under di
Electronics Forum | Thu Jul 20 13:57:04 EDT 2000 | Boca
I am not answering for Techguy2000, but I am chiming in here, I have the same problem. Our resistor packs are ceramic body with no leads, they have a metalized area reminicent of the old castelation leads of year gone by. The lead pitch is 50 mil
Electronics Forum | Mon Mar 08 05:03:24 EST 2010 | grahamcooper22
Hi, I fully agree with isd.jww. The difference in the solder joint appearance of the 2 joints highlighted could be down to a few reasons...reflow profile (I know you've checked, but have you stuck a thermocouple on this actual joint ? ), contaminatio
Electronics Forum | Tue Apr 24 09:12:07 EDT 2007 | patrickbruneel
I want to say one more thing on this; many times RoHS is compared to the CFC elimination. But there is a huge difference between the two for following reasons: In late 80�s scientific evidence became available that CFC�s contributed greatly to the o
Electronics Forum | Thu May 21 11:39:21 EDT 1998 | Brian L. Pollitt
| We are looking to bring in a HP 5DX System. This is | the laminography equipment formerly known as Four Pi. | I have our sales rep getting us a few references, but I | wanted to get some opinions from the tech net. | I am looking for input from
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
