Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Industry News | 2012-10-10 17:26:45.0
SMTA and CALCE are pleased to announce that the program is finalized for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium West. The program is available on-line at www.smta.org/counterfeit and registration is open
Industry News | 2011-09-21 11:41:28.0
SMTA and CALCE are pleased to announce that the program for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium West is finalized and available on-line at smta.org/counterfeit and registration is open. The event will take place December 6-8, 2011 at the Crowne Plaza Anaheim Resort in Anaheim, California.
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Industry News | 2022-12-07 07:35:10.0
The Anti-Counterfeiting Forum, CALCE and SMTA are very pleased to announce that they will be jointly hosting the Counterfeit Electronics and Materials Symposium at the Manufacturing Technology Centre in Coventry, UK, on 14th and 15th March 2023. This international event will feature domain expert speakers from Europe and USA and builds on the history of past events held in the USA by SMTA and CALCE and by the Anti-Counterfeiting Forum in the UK.
Industry News | 2018-08-29 19:35:22.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.
Industry News | 2020-02-18 14:26:44.0
Deadline extended to February 21, 2020
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Technical Library | 2016-11-17 14:58:02.0
Since 2006 RoHS requirements have required lead free solders to take the place of tin-lead solders in electronics. The problem is that in some environments the lead free solders are less reliable than the older tin-lead solders. One of the ways to solve this problem is to corner stake, edge bond or underfill the components. When considering what mitigation technique and material to use, the operating conditions must be characterized. The temperature range is important when selecting a material to use since the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are important properties. If improperly chosen, the mitigation material can cause more failures than an unmitigated component.
