Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Technical Library | 2020-01-01 17:06:52.0
The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.
Technical Library | 2021-08-11 01:00:37.0
Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.
Industry News | 2014-10-14 16:56:40.0
Aqueous Technologies announcing that registration open for the fourth webinar of its five-part Cleaning and Reliability Live Webinar Series. The fourth webinar, entitled “To Drain or Not to Drain – Environmental Mitigation Techniques” is scheduled to take place Wednesday, Oct. 22, 2014 at 10 a.m. (PDT).
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue May 15 00:00:00 EDT 2018 - Tue May 15 00:00:00 EDT 2018 | ,
Parts and Assembly Storage Life: How to Determine and Manage
Industry News | 2015-06-24 20:04:07.0
Aqueous Technologies is pleased to announce that its technical webinar series is now available for on-demand viewing.
Industry News | 2013-11-05 22:51:20.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
Industry News | 2005-11-03 11:14:00.0
Parvus to transition to lead-free production of embedded PC products by July 1, 2006; Parvus to focus on reliability assurance and risk mitigation techniques with high-reliability customers
