Technical Library | 2021-09-21 20:20:22.0
The electronics industry has been using the epoxy puck for the processing of the vast majority of electronics microsections since the 1970s. Minimal advancements have been seen in the methods used for precision micro-sections of PCBs, PCBAs, and device packages. This paper will discuss different techniques and approaches in performing precision and analytical micro-sections, which fuse the techniques and materials common in preparation of silicon wafers and bulk materials. These techniques have not only been found to produce excellent optical results, but transfer effectively to SEM for high magnification inspection and further analysis with minimal post-lapping preparation needed. Additionally, processing time is reduced primarily due to a significant reduction of bulk material removal earlier in the preparation, therefore needing less removal at later lapping steps compared to traditional sectioning methods. Additional techniques are introduced that mitigate some classic challenges experienced by technicians over the decades.
Industry News | 2014-04-08 11:43:03.0
Isola Group has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. "Isola USA", reduces the number of voids in resin-impregnated dielectrics, which is a major source of CAF failures.
Industry Directory | Manufacturer
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments.
Industry News | 2014-09-08 12:38:53.0
Aqueous Technologies announces that Mike Konrad and John Hall will present at the Assembly Cleaning, Coating and Reliability Workshop. The event is scheduled to take place Tuesday, Sept. 16, 2014 from 9 a.m.-3:30 p.m. at Henkel Consumer Goods Inc.’s facility in Scottsdale, AZ.
Industry News | 2022-05-05 17:38:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
Industry News | 2021-02-23 15:19:10.0
NEOTech is thrilled to congratulate Numerica Corporation on the announcement of their new short range surveillance radar system – Spyglass™ Short Range Surveillance Radar. NEOTech is proud to be in partnership with Numerica, providing manufacturing solutions for the Spyglass system.
Industry News | 2019-01-12 07:53:43.0
Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.
Industry News | 2011-06-01 21:14:28.0
Indium Corporation Senior Technical Support Engineer Chris Nash will present his technical findings at the Huntsville SMTA Expo and Tech Forum on June 22, in Huntsville, AL.
Industry News | 2021-07-26 17:33:25.0
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
