Industry News | 2020-02-13 15:42:07.0
Industrial OEMs see value in optimizing the right flash technology to ensure host architecture compatibility while meeting application workload requirements
Electronics Forum | Mon Dec 12 09:39:39 EST 2005 | Amol Kane
thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there wont be any whisker formation DUE TO THE IMM TIN COATING.....whiskers could still potentially form as a result of COMPONENT FINISHES and effective miti
Electronics Forum | Wed Sep 12 00:18:19 EDT 2018 | aqueous
Here's a link to an article regarding foam mitigation techniques. It my be helpful. There are many causes of foam. Water alone does not foam. Flux, solubilized in to the water can produce foam. Defluxing additives contain defaming agents which should
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
