Industry News | 2013-05-11 22:01:39.0
The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
Industry News | 2015-01-22 13:11:04.0
Juki Automation Systems will exhibit in Booth #918 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Juki will display three complete lines; a high-speed line, a high-mix line, and an LED / odd-form advanced technology line that will feature through-hole placement and selective soldering.
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the
Industry News | 2017-04-23 10:57:38.0
MicroCare Asia will use NEPCON Shanghai from 25-27 April as the platform in which to highlight three innovative new cleaning chemistries of the Tergo™ family: the Tergo™ Metal Cleaning Fluid, the Tergo™ Chlorine-Free Cleaning Fluid and the Tergo™ High-Performance Flux Remover.
Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe
This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control
Industry News | 2022-04-06 11:58:04.0
Indium Corporation's Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the company's award-winning Durafuse™ mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse™ Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Industry News | 2008-09-08 18:17:57.0
Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.
