In some cases stationary systems are not feasible: Typical applications are in-field inspection of pipelines, power-plants, factories or spot checks. Operators look for common wear and tear faults like corrosion or weld-cracks. Many industries like
Electronics Forum | Mon Sep 06 04:42:18 EDT 2004 | KenF
Thx for the replies. Acutally I am doing a process related study to see whether the process (pcb depanelling)can induce crack to an MLCC. After depanelling, I will do a thermal shock on the MLCC based on IEC 384-1, that is, five cycles of 30min at hi
Electronics Forum | Fri Sep 03 11:28:18 EDT 2004 | KenF
Fine crack in multi-layer ceramic capacitor (MLCC) may not be detectable by capacitance check.Could anyone out there advise which is the most appropriate method to test/detect fine crack ?
.jpg)
Used SMT Equipment | Soldering - Reflow
Features 1. Full hot air reflow heat fast, high thermal efficiency compensation, delta t less than ± 2 ℃ soldering is uniform. 2. HELLER company has 40 years of history, process maturity. 3. maintenance costs low, the furnace normal use, electrici
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-09-06 15:18:14.0
Although many High Q capacitors are available on the market, performance can vary widely depending on design and quality of manufacturing
Technical Library | 2009-05-21 13:41:05.0
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.
Technical Library | 2018-08-29 21:17:53.0
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern.
Failure due to board flex cracks persists as the do
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
Published in Packaging Article Tools Dec 2009 AVOIDING MISMATCH IN POP ASSEMBLY - NEW ACOUSTIC METHOD EXAMINES WARPED BGAS As Published in EPP Europe Sept 2009 FINDING SINGULATION CAUSED CRACK IN MLCC
.gif)
