Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative
Dummy Components and IC Assembly/IC Packaging Service Provider
MLF leadless CSP with daisy chain for solder practice and temperature profiling.
Electronics Forum | Sat Mar 29 01:59:09 EST 2003 | iman
Yep, only the MLF have this blowhole/pinhole issue. Other components like SOT(transistor), CAP, RES are hey-o-kie. Btw, MLF = micro lead frame (IC/LGA) package. looks like a BGA without the solder balls. has direct attachment to the PCB ENIG pads wi
Electronics Forum | Mon Apr 09 01:01:33 EDT 2007 | Haris
And check also your component company,sometimes component quality varies with the change of the company.
Used SMT Equipment | X-Ray Inspection
Phoenix Microme|x 160 kV 160 kV proprietary sub-micron X-ray source (open design) with “unlimited” lifetime, including a demountable collimator for enhanced image quality X-ray protection cabinet, including laser-crosshair positioning aid
Used SMT Equipment | In-Circuit Testers
JDSU MTS-8000 The MTS-8000 is a field-scalable optical test platform for both installation and maintenance. Based on the rich MTS-5000 heritage, the MTS8000 is the industry's most innovative and cost-effective test solution for metro networks. A
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Contact|Mac Sales-manager:-Mac-Xie Mobile:-+8618020714662(Whatsapp) Email:-at@mooreplc.com Skype:-+8618020714662 ===>Contact|Mac ⇉Quick---Details ⇇ • Cable Length: 7 metres (22.9 feet) • Connector Protector and Cable Option: Standard Cable
Contact|Mac Sales-manager:-Mac-Xie Mobile:-+8618020714662(Whatsapp) Email:-at@mooreplc.com Skype:-+8618020714662 ===>Contact|Mac ⇉Quick---Details ⇇ Brand:BENTLY NAVADA Part Number:330130-075-00-00 Description:Extension Cable
Lewis & Clark | http://www.lewis-clark.com/product-tag/metcal-5000/
: • Max PCB Dimensions 250mm x 230mm • PCB Thickness 0.5 – 2.0mm • Component types BGA, CPS, LGA, Micro SMD, MLF, Bumped chip • Airflow 8-24 LPM • Pre-heater base • Heater element 350W top
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/model-rw-sv2000a-bga-rework-station
. 1 year part warranty. Lifetime technical support. Suitable for large Servo, Base station, Industrial computer repair, able to rework difficult components like CGA 、 BGA 、 QFN 、 CSP 、 LGA 、 Micro SMD 、 MLF(Micro Lead Frames
